TRISOLEGY
Triple-junction and IMM technology, radiation-hardened. BOL efficiency up to 32%. Flight-proven across every orbit regime.
Typical Electrical Performance (AM0, 1353 W/m², 25℃)
Typical Performance Data — TJ32
| Parameter | BOL | 1E14 | 5E14 | 1E15 |
|---|---|---|---|---|
| Efficiency ηbare (%) | 32.0 | 30.4 | 28.3 | 26.9 |
| Short Circuit Jsc (mA/cm²) | 19.0 | 18.8 | 18.4 | 17.9 |
| Open Circuit Voc (V) | 2.70 | 2.60 | 2.49 | 2.44 |
| Current @ Max. Power Jm (mA/cm²) | 18.3 | 18.2 | 17.8 | 17.1 |
| Voltage @ Max. Power Vm (V) | 2.37 | 2.26 | 2.15 | 2.13 |
Typical Electrical Performance (AM0, 1353 W/m², 25℃)
Typical Performance Data — TJ30
| Parameter | BOL | 1E14 | 5E14 | 1E15 |
|---|---|---|---|---|
| Efficiency ηbare (%) | 30.0 | 28.8 | 27.0 | 25.8 |
| Short Circuit Jsc (mA/cm²) | 17.5 | 17.4 | 16.8 | 16.3 |
| Open Circuit Voc (V) | 2.75 | 2.64 | 2.58 | 2.53 |
| Current @ Max. Power Jm (mA/cm²) | 16.6 | 16.4 | 16.0 | 15.5 |
| Voltage @ Max. Power Vm (V) | 2.45 | 2.38 | 2.28 | 2.25 |
Cover-glass Interconnect Cells — Structural Features
Bypass Diode
| Forward Voltage (+2.5A) | < 1.0 V |
|---|---|
| Reverse Current (−4.5V) | < 0.7 mA |
Interconnector
| Type | Pull Test @ 45° |
|---|---|
| Silver | > 1.6 N |
| Kovar (silver coated) | > 1.6 N |
1353 W/m² · T = 25℃
| Parameter | Value |
|---|---|
| Efficiency ηbare (%) | 32 |
| Open Circuit Voc (V) | 2.70 |
| Short Circuit Jsc (mA/cm²) | 18.8 |
| Current @ Max. Power Jm (mA/cm²) | 18.2 |
| Voltage @ Max. Power Vm (V) | 2.36 |
Cover-glass Interconnect Cells — Structural Features
Bypass Diode
| Forward Voltage (+2.5A) | < 1.0 V |
|---|---|
| Reverse Current (−4.5V) | < 0.7 mA |
Interconnector
| Type | Pull Test @ 45° |
|---|---|
| Silver | > 1.6 N |
| Kovar (silver coated) | > 1.6 N |
1353 W/m² · T = 25℃
| Parameter | Value |
|---|---|
| Efficiency ηbare (%) | 30 |
| Open Circuit Voc (V) | 2.74 |
| Short Circuit Jsc (mA/cm²) | 17.4 |
| Current @ Max. Power Jm (mA/cm²) | 16.5 |
| Voltage @ Max. Power Vm (V) | 2.44 |
CIC Thermal Absorption & Temperature Gradient
Covering TJ32 / TJ30 solar cells and CIC assemblies — triple-junction GaAs technology, radiation-hardened, BOL efficiency up to 32%, suitable for all orbits from LEO to deep space.
